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on 21 September 2022

ESA Open Invitation to Tender: 1-11243
Open Date: 21/09/2022 08:13 CEST
Closing Date: 02/12/2022 13:00 CEST

The objective of the activity is to design, assemble and test a Ka-band RF front end system-in-package integrating amplification, beamforming and analogue-to-digital signal conversion as needed for active antenna applications. Heterogeneous integration techniques will be used to manufacture the system-in-package.Targeted Improvements:- 20% insertion loss reduction and lower inductances in the RF circuit,- 30% reduction in RF front-end module size and mass,- 30% reduction of power consumptionDescription:Today, very high throughput satellite telecommunication systems need to process ever larger amounts of data. This can lead to a significant increase in the number of active antenna radiating elements. At the same time, their dimensions decrease with the use of higher frequencies. Current Ka-band payload architectures are based on discrete separate elements: Low Noise Amplifiers (LNA), analogue Beam-Forming Network (BFN), RF harness and Analogue-to-Digital Converters (ADC). One approach to reduce mass and insertion loss and to simplify the receive front-end connectivity network is to integrate these elements and create a unique digital interface. Future payload architectures will be implemented typically by combining 4 to 16 (or more) LNAs and sub-array BFNs to one ADC, or a direct chain comprising an LNA and an ADC per feed element. This calls for associated innovations in direct conversion components, together with a higher level of integration in a System-in-Package (SiP) approach. SiP have already been successfully demonstrated for the integration of beam forming networks, frequency converters or digital parts. However, mixed signal applications at Ka-band have not been addressed to date. This activity will cover the design, assembly and electrical testing of a Ka-band SiP breadboard that integrates the latest advanced technologies: III-V components, silicon components (CMOS, BiCMOS) and other passive components (surface mount devices).Active elements will include the LNA, the BFN and the ADC. Alternative mixed signal line-ups may be proposed, depending on the targeted payload architecture and applications. The assembly technologies could range from 2D to 2.5D packaging, from an RF organic substrate to a silicon interposer, and include re-distribution layers or through-silicon vias. Component assembly technologies may include flip-chip mounting, chip-on-board technology, fan-out wafer level packaging and others. In the course of this activity, the best combination of components, materials and processes will be identified and characterised. Reliability assessment of the heterogeneous assembly process will be carried out (e.g. interconnection of III-V and silicon components on an organic substrate) and the performance of the Ka-band RF front-end system-in-package will be quantified in a laboratory environment.

Directorate: Directorate Telecom Integrated Applica
Estabilishment: ESTEC
ECOS Required: No
Classified: No
Price Range: > 500 KEURO
Authorised Contact Person: Audrey Ferreol
Initiating Service: TIA-TTS
IP Measure: N/A
Prog. Reference: E/0534-01G - CC-AT 4.0.1
Tender Type: Open Competition
Technology Keywords: 6-D-II-Telecommunication Payloads
Products Keywords: 2-L-2/3/4.1-n-Other

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